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Concurrent chip and package design for radio and mixed-signal systems
The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. To fully utilize the benefits of these new hardware …
Contributors
- Zheng Li-Rong
- Gong Shaofang
- KTH Skolan för informations- och kommunikationsteknik (ICT) Mikroelektronik och Informationsteknik, IMIT
Creator
- Shen Meigen 1970- , KTH, Mikroelektronik och Informationsteknik, IMIT
Publisher
- KTH
Date
- 2005
- 2005-11-24
- 2005-11-03
- 2005-11-03
- 2005-11-24
- 2005
Contributors
- Zheng Li-Rong
- Gong Shaofang
- KTH Skolan för informations- och kommunikationsteknik (ICT) Mikroelektronik och Informationsteknik, IMIT
Creator
- Shen Meigen 1970- , KTH, Mikroelektronik och Informationsteknik, IMIT
Publisher
- KTH
Date
- 2005
- 2005-11-24
- 2005-11-03
- 2005-11-03
- 2005-11-24
- 2005
Providing institution
Aggregator
Rights statement for the media in this item (unless otherwise specified)
- http://rightsstatements.org/vocab/InC/1.0/
- http://rightsstatements.org/vocab/InC/1.0/
Identifier
- oai:DiVA.org:kth-476
Format
- electronicxi, 55
- electronic
- xi, 55
Language
- en
- -1
Is part of
- http://data.theeuropeanlibrary.org/Collection/a1041
Relations
- Trita-IMIT. LECS1651-407605:09
Year
- 2005
Providing country
- Sweden
Collection name
First time published on Europeana
- 2014-09-07T11:07:17.170Z
Last time updated from providing institution
- 2014-09-07T11:07:17.170Z